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  STANDARD TECHNOLOGY PCBs
Online Specials for 6 mils trace/space. Includes soldermask and silkscreen.


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  HIGHER TECHNOLOGY PCBs
All kinds of complex PCBs. Up to 22 layers. Special materials and thicknesses, blind-buried vias, controlled impedance, metal-core etc. Upload your files and get quote by email.
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  ASSEMBLY SERVICES
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PCB FAB EXPRESS Manufacturing Capabilities

PCB FAB EXPRESS Capability
Product Features Standard Capability Advanced Capability
Board Attributes
Min Layer count 1 1
Max Layer Count2426+
Min Board Thickness.010".004"
Max Board Thickness.200".200" +
Min Core Thickness.002".002"
Min Dielectric.002".0015"
Min. Starting Copper Foil Weight9 micron< 5 micron
Max. Finished Copper Thickness (O/L)6 oz> 6 oz
Max. Finished Copper Thickness (I/L)4 oz> 4 oz
Maximum Panel Size21" x 29"21" x 29"
Minimum Panel Size12" x 18"12" x 18"
Smallest Mech Drill Diameter.0059".004"
Smallest Laser Drill Diameter.006".004"
Min Finished Hole Size.004".002"
Max Thru Hole Aspect Ratio16:01>16:1
Max Blind Via Aspect Ratio.75:11.2:1
Blind Via Finished Hole Size.004"Plated shut
Buried Via Finished Hole Size.004".002"
Min LW/LS (mils).003".002"
Min Pad Size for test.005".003"
Process Pad DiameterD + .012" (1 mil annular ring)D + .010" (Tangency)
Controlled Impedance Tolerance10%5%
Solder Mask Registration.002"<.002"
Solder Mask Feature Tolerance.001".001"
Solder Mask Min Dam Size.004".002"
Min. Diameter Rout Cutter Available.024".021"
Routed Part Size Tolerance.010"<.010"
Bow & Twist Tolerance7%<7%
Thickness Tolerance10%< 10%
 
Sequential LamYesYes
Buried ViasYesYes
Blind ViasYesYes
Conductive Filled ViasYesYes
Non Conductive Filled ViasYesYes
Surface Finishes
HASL (Vertical or Horizontal)YesYes
Lead Free HASLYesYes
OSP (Shikoku F2)YesYes
OSP (Entek)YesYes
ENIGYesYes
Immersion SilverYesYes
Immersion White TinYesYes
Tin NickelYesYes
Electrolytic Soft GoldYesYes
Electrolytic Hard GoldYesYes
Selective GoldYesYes
Solder Masks
Semi - Gloss GreenYesYes
Gloss GreenYesYes
Matte - GreenYesYes
BlackYesYes
RedYesYes
BlueYesYes
YellowYesYes
Legend
All colorsYesYes
Fab
Routed ArrayYesYes
V ScoreYesYes
CountersinkYesYes
CounterboreYesYes
BevelYesYes
MillingYesYes
Edge CastellationYesYes
Edge PlatingYesYes
HeatsinksYesYes
Electrical Test
10 VoltYesYes
40 Volt (Burn in bds)YesYes
250 VoltNoYes
500 VoltNoYes
Hi PotNoYes
Laminate Materials
Very Thin FilmNoYes
Arlon 85NTYesYes
Hybrid ConstructionsYesYes
Isola FR406YesYes
Isola FR408YesYes
Isola IS410YesYes
Isola IS620NoYes
Isola P95YesYes
Isola P96YesYes
Matsushita R1766YesYes
Matsushita R1755YesYes
Matsushita MegtronYesYes
Nelco N4000-13 (SI)YesYes
Nelco N4000-6 FCYesYes
Nelco N4000-29YesYes
Neltec N7000-2YesYes
No Flow Pre PregYesYes
Polyclad PCL370HRYesYes
Polyclad GetekYesYes
PSA Bond FilmNoYes
Rogers 3000YesYes
Rogers R4003YesYes
Rogers R4350YesYes
Rogers 5880YesYes
Rogers 6000YesYes
Rogers TMMYesYes
Available Reports
MicrosectionYesYes
SolderabilityYesYes
X-ray FluorescenceYesYes
Ionic ContaminationYesYes
Time Domain Reflectometry test (TDR)YesYes
FAIYesYes
Certificate of Compliance (C of C)YesYes
UL
94VOYesYes
PCB Classifications
Military 55110YesYes
IPC 6012, Class 1, 2 & 3YesYes
ISO 9001:2000YesYes
Capabilities By Market:
 
1.High Reliability Boards
  -Up to 2000 Thermal cycles
  -For Boards that must not fail
 
2.Burn-in Boards
  -14 Layers - .062" thick
  -.5 mm pitch
  -Step-down connectors
  -Special materials
  -Large sizes up to 24" x 28"
  -High Reliability
 
3.High Technology Boards
  -Differential Impedance
  -Up to 30 Layers
  -Lead Free process
  -Special materials
  -Sequential lamination
  -Blind and buried vias
  -Laser Drill
  -Filled vias
  -Via in pads
  -Milspec
  -Metal core
  -Carbon paste
  -Plated edges
  -Plated edge holes
  -Milling
  -Heavy Copper
  -Selective Finishes
 
4.Standard Technology Boards
  -1 to 10 Layers
  -Trace/Space 5/5
  -Same day for 2 Layers
  -24 hours to 10 Days for multilayers
  -Lead Free process
  -All standard materials

Capabilities By Process:

Front-end CAM
 -Fully automated Tooling System
 
Imaging-Laser Direct Imaging
 -Trace/Space 2/2
 
Multilayer Lamination
 -Up to 30 Layers
 -Sequential lamination
 -Automated registration
 
Drilling
 -.006" Mechanical Drill
 -Laser Drill down to 2 mils (.002")
 
Etching
 -Trace/Space 2/2 mils
 
Plating
 -Aspect ratio 10+
 
Soldermask
 -LPI, Dry Film
 
Silkscreen
 -Automated
 -5 mil lines
 
Fabrication
 -Route and retain
 -Scoring
 
Electrical Test
 -.5mm pitch, Flying probe and High Density grid
 
Quality and Production Control Information System
 -Pro-CIM
 
Materials
 -Lead Free FR-4
 -Polyimides
 -Rogers 4003 & 4350
 -Teflons
 -Ceramics
 -Most other materials
 
 



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